LED automotive lights are constructed from gold wires, LED chips, reflective rings, cathode wires, plastic wires, and anode wires. Their core is a chip composed of p-type and n-type semiconductors, with a transition layer between them called a pn junction. The light-emitting process of an LED consists of three parts: carrier injection under forward bias, recombination radiation, and light energy transmission. Photon energy determines the color of light; different materials have different band gaps, thus emitting different colors of light.
Currently, there are three main heat dissipation technologies for LED automotive lights on the market. The first is aluminum body heat dissipation (first generation), which involves designing a copper heat-conducting plate inside the aluminum body. The heat dissipated by the LED headlight is conducted to the copper heat-conducting plate and then transferred to the bottom of the aluminum body and various corners, allowing the heat to dissipate rapidly. The second is heat pipe heat dissipation (second generation). The superconducting heat pipe consists of a copper tube, capillary structure, and working fluid. One end of the heat pipe is the evaporation zone, the other end is the condensation zone, and the middle part is the adiabatic section. One method involves inserting a hollow heat-dissipating metal plate containing liquid inside the LED lamp body. When the lamp heats up, the liquid inside absorbs heat, turns into gas, and diffuses to other areas of the heat sink and the aluminum rear cover, achieving heat exchange and even dissipation. The third method is a vapor chamber heat conduction circulation system (third generation). This system primarily uses a vapor chamber and copper fins for heat dissipation. The vapor chamber distributes the central heat-generating temperature of the LED lamp over a large area for even heat dissipation and rapid conduction. Currently, LED lamp manufacturers are experimenting with combining various heat dissipation technologies to improve lamp cooling.
