COB packaging technology mounts LED chips directly onto a circuit board, forming a planar light source. It boasts high luminous efficiency and large luminous flux, making it suitable for headlights, but may suffer from stray light, glare, and heat dissipation issues. High-power ceramic-based LEDs utilize efficient vertical chips, improving heat dissipation and brightness, but stray light and glare problems persist. CSP-LEDs are favored for their compact size and high luminous efficiency, making them particularly suitable for applications requiring precise optical design, such as taillights. The five-sided emission of CSP-LEDs results in high luminous flux utilization. CSP-COB uses flip-chip tightly packed arrays to form a linear light-emitting area, resulting in high central brightness, no dark areas, and high luminous flux utilization, making it ideal for headlights. 2016-LED packaging is a true linear light source, arranging small LEDs linearly on a light panel, suitable for high-end LED headlights, ensuring luminous efficiency and good thermal conductivity.
Depending on the LED current required for the application, in low-current applications ranging from 20 to 200 mA, resistors or constant current regulators (CCRs) can be used. For medium-current applications (200-500 mA), linear or switching driver solutions can be used. For high-current applications (greater than 500 mA), switching driver solutions are generally preferred. For complex applications such as headlights, highly integrated lighting management ICs are available, capable of driving and controlling various lamp types with energy efficiency exceeding 90%. With the increasing penetration of intelligent automotive lighting and the acceleration of domestic substitution, domestic manufacturers have also launched high-performance automotive-grade driver chips.
